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 HD26C31
Quadruple Differential Line Drivers With 3 State Outputs
REJ03D0292-0200Z (Previous ADE-205-574 (Z)) Rev.2.00 Jul.16.2004
Description
The HD26C31 features quadruple differential line drivers which satisfy the requirements of EIA standard RS-422A. This device is designed to provide differential signals with high current capability on bus lines. The circuit provides enable input to control all four drivers. The output circuit has active pull up and pull down and is capable of sinking or sourcing 20 mA.
Features
* TTL input compatibility * Propagation delay time: 6 ns typ * Output to output skew: 0.5 ns typ * High output impedance in power off conditions * Meets EIA standard RS-422A * Operates from a single 5 V supply * Three state outputs * Low power dissipation with CMOS process * Power up and power down protection * Pin to pin compatible with HD26LS31 * Ordering Information
Part Name HD26C31FPEL Package Type Package Code FP Package Abbreviation Taping Abbreviation (Quantity) EL (2,000 pcs/reel)
SOP-16 pin (JEITA) FP-16DAV
Rev.2.00, Jul.16.2004, page 1 of 11
HD26C31
Pin Arrangement
1A 1 1Y 2 1Z 3 Enable G 4 2Z 5 2Y 6 2A 7 GND 8
16 VCC 15 4A 14 4Y 13 4Z 12 Enable G 11 3Z 10 3Y 9 3A
(Top view)
Function Table
Input A H L H L X H L X Z : : : : High level Low level Irrelevant High impedance H H X X L Enables G X X L L H G H L H L Z Outputs Y L H L H Z Z
Absolute Maximum Ratings (Ta = 25C)
Item Supply Voltage*2 Input Voltage Output Voltage Power Dissipation Storage Temperature Range Lead Temperature*3 Output Current VCC VIN VOUT PT Tstg Tlead IOUT Symbol Ratings -0.5 to 7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 500 -65 to 150 260 150 Unit V V V mW C C mA
Supply Current ICC 150 mA Notes: 1. The absolute maximum ratings are values which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 2. The values is defined as of ground terminal. 3. The values at 1.6 mm away from the package within 10 second, when soldering.
Rev.2.00, Jul.16.2004, page 2 of 11
HD26C31
Recommended Operating Conditions (Ta = -40C to +85C)
Item Supply Voltage Input Voltage Output Voltage Operating Temperature Input Rise/Fall Time*1 Note: Symbol VCC VIN VOUT Ta tr, tf 4.5 0 0 -40 -- Min 5.0 -- -- 25 -- Typ 5.5 VCC VCC 85 500 Max V V V C ns Unit
1. This guarantees maximum limit when one input switches.
Logic Diagram
1A 1Y 1Z 2Y 2Z 3A 3Y 3Z 4A Enable G Enable G 4Y 4Z
2A
Rev.2.00, Jul.16.2004, page 3 of 11
HD26C31
Electrical Characteristics (Ta = -40C to +85C)
Item Input Voltage Output Voltage Differential Output Voltage Symbol VIH VIL VOH VOL VT Min 2.0 -- 2.4 -- 2.0 Typ -- -- 3.4 0.2 3.1 Max -- 0.8 -- 0.4 -- V V V V V VIN = VIH or VIL, IOH = -20 mA VIN =VIH or VIL, IOL = 20 mA RL = 100
VT 50 50 VOS
Unit
Conditions
Difference In Differential Output Common ModeOutput Voltage Difference In Output Common Mode Input Current Supply Current Off State Output Current
IVTI - IVTI VOS
-- --
-- 1.8 -- -- 200 0.8 0.5 -- --
0.4 3.0 0.4 1.0 500 2.0 5.0
V V V A A mA A VIN = VCC, GND, VIH or VIL IOUT = 0 A, VIN = VCC or GND IOUT=0 A, VIN = 2.4 V or 0.5 V VOUT = VCC or GND, G = VIL, G = VIH VIN = VCC or GND VCC = 0 V, VOUT = 6 V
IVOS - VOSI -- IIN ICC ICC*2 IOZ -- -- -- -- -30 --
Short Circuit Output Current ISC*3 Output Current with Power IOFF
-150 mA 100 A
Off IOFF -- -- -100 A VCC = 0 V, VOUT = -0.25 V Notes: 1. All typical values are at VCC = Ta = 25C. 2. 1 input: VIN = 2.4 V or 0.5 V, other inputs: VIN = VCC or GND 3. Not more than one output should be shorted at a time and duration of the short circuit should not exceed one second.
Switching Characteristics (Ta = -40C to +85C, VCC = 5 V 10%)
Item Propagation Delay Time Output To Output Skew Differential Output Transition Time Output Enable Time Output Disable Time Power Dissipation Capacitance Input Capacitance Symbol tPLH tPHL Skew tTLH tTHL tZL tZH tLZ tHZ CPD CIN -- -- -- -- -- Min 2.0 2.0 -- Typ 6.0 6.0 0.5 6.0 6.0 11.0 13.0 5.0 7.0 50.0 6.0 Max 11.0 11.0 2.0 10.0 10.0 19.0 21.0 9.0 11.0 -- -- Unit ns ns ns ns ns ns ns ns ns pF pF Conditions Test Circuit (1)
Test Circuit (3) Test Circuit (2)
Rev.2.00, Jul.16.2004, page 4 of 11
HD26C31 Test Circuit 1
VCC Input Y C1 Z VCC G Output G C3 Output C2 R1 R3 1.5 V S1 OPEN R2
Palse Generator Zout = 50
A
Note:
1. C1, C2 and C3 (40 pF) include probe and jig capacitance. R1 = R2 = 50 , R3 = 500
Waveforms 1
tr Input A 10 % t PLH Output Y 90 % 1.3 V 90 % 1.3 V 10 % t PHL VOH 1.3 V 1.3 V VOL t PHL t PLH VOH Output Z 1.3 V 1.3 V VOL VOH Output Y 50 % 50 % VOL Skew Skew VOH Output Z 50 % 50 % VOL tf 3V 0V
Notes:
1. tr 6 ns, t f 6 ns 2. Input waveforms: PRR = 1 MHz, duty cycle 50%
Rev.2.00, Jul.16.2004, page 5 of 11
HD26C31 Test Circuit 2
VCC VCC Output A Input R1 R3 1.5 V S1 CLOSED R2
Y C1 Z
C2
C3 Output
Pulse Generater Zout = 50
G G
Notes:
1. tr 6 ns, t f 6 ns 2. Input waveforms: PRR = 1 MHz, duty cycle 50%
Waveforms 2
tr Enable G 10 % t LZ Output Y 90 % 1.3 V 90 % 1.3 V 10 % t ZL 1.5 V VOL + 0.3 V 0.8 V VOL t HZ t ZH VOH Output Z VOH - 0.3 V 2.0 V 1.5 V tf 3V 0V
Enable G
Notes:
1. tf 6 ns, t f 6 ns 2. Input waveforms: PRR = 1 MHz, duty cycle 50%
Rev.2.00, Jul.16.2004, page 6 of 11
HD26C31 Test Circuit 3
Input R1 R3 1.5 V S1 OPEN R2
Pulse Generator Zout = 50 VCC G G
A
Y Output Z C1
C2
C3
Ach Bch Oscilloscope Bch Invert Ach Add Bch
Note:
1. C1, C2 and C3 (40 pF) include probe and jig capacitance. R1 = R2 = 50 , R3 = 500
Waveforms 3
tr Input A 10 % 90 % 90 % 10 % tf 3V 0V
90 %
90 %
Output (Differential)
10 % t TLH t THL
10 %
Notes:
1. tr 6 ns, t f 6 ns 2. Input waveforms: PRR = 1 MHz, duty cycle 50%
Rev.2.00, Jul.16.2004, page 7 of 11
HD26C31
HD26C31 Line Driver Applications
The HD26C31 is a line driver that meets the EIA RS-422A conditions, and has been designed to supply a high current for differential signals to a bus line. Its features are listed below. * * * * Operates on a single 5 V power supply. High output impedance when power is off Sink current and source current both 20 mA On-chip power up/down protection circuit
As shown by the logic diagram, the enable function is common to all four drivers, and either active-high or active-low can be selected. The output section consists of two output stages (the Y side and Z side), each of which has the same sink current and source current capacity. Connection of a termination resistance when the HD26C31 is used as a balanced differential type driver is shown.
Output Characteristics ("H" Level) 5.0 Ta = 25C
Output Voltage VOH (V)
4.0 VCC = 5.5 V VCC = 5.0 V
3.0 2.0
1.0
VCC = 4.5 V
0
-20 -40 -60 -80 Output Current IOH (mA)
-100
Figure 1 IOH vs. VOH Characteristics
Output Characteristics ("L" Level) 0.5 Ta = 25C VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V
Output Voltage VOL (V)
0.4
0.3 0.2 0.1
0
20 40 60 80 Output Current IOL (mA)
100
Figure 2 IOL vs. VOL Characteristics When termination resistance RT is connected between the two transmission lines, as shown in figure 3 the current path situation is that current IOH on the side outputting a high level (in this case, the Y output) flows to the side outputting a low level (in this case, the Z output) via RT, with the result that the low level rise is large. If termination resistance RT is dropped to GND on both transmit lines, as shown in figure 4 the current path situation is that the current that flows into the side outputting a low level (in this case, the Z output) is only the input bias current from the receiver. As this input bias current is small compared with the signal current, it has almost no effect on the differential input signal at the receiver end.
Rev.2.00, Jul.16.2004, page 8 of 11
HD26C31 Figure 5 shows the output voltage characteristic when termination resistance RT is varied. Also, when used in a party line system, etc., the low level rises further due to the receiver input bias current, so that it is probably advisable to drop the termination resistance to GND. However, the fact that it is possible to make the value of RT equal to the characteristic impedance of the transmission line offers the advantage of being able to hold the power dissipation on the side outputting a high level to a lower level than in the above case. Consequently, the appropriate use must be decided according to the actual operating conditions (transmission line characteristics, transmission distance, whether a party line is used, etc.). Figure 6 shows the output characteristics when termination resistance RT is varied.
Y "H" IOH
RT "L" Z IOL IIN (Receiver)
Figure 3 Example of Driver Use-1
IOH RT "L" Z RT IIN (Receiver)
Y
"H"
Figure 4 Example of Driver Use-2
Output Voltage vs. Termination Resistance
Output Voltage VOH(Y), VOL(Z) (V)
10 VOH(Y) 1 Y RT 0.1 "H" RT Z VOL(Z) 50 100 200 500 1k 2k 5k 10k 20k 50k Termination Resistance RT () VOL VOH GND
0.01
0.001 10 20
Figure 5 Termination Resistance vs. Output Voltage Characteristics A feature of termination implemented as shown in figure 7 is that power dissipation is low when the duty of the transmitted signal is high. However, care is required, since if RT is sufficiently small, when the output on the pulled-up side goes high, a large current will flow and the output low level will rise. Figure 8 shows the output characteristics when termination resistance RT is varied.
Rev.2.00, Jul.16.2004, page 9 of 11
HD26C31
Output Voltage vs. Termination Resistance
Output Voltage VOH(Y), VOL(Z) (V)
10 VOH(Y) 1 Y VCC = 5 V Ta = 25C RT VOH Z GND VOL
0.1
"H" VOL(Z)
0.01
0.001 10 20
50 100 200 500 1k 2k 5k 10k 20k 50k Termination Resistance RT ()
Figure 6 Termination Resistance vs. Output Voltage Characteristics
VCC Y Data input RT
Z
RT
Figure 7 Example of Driver Use-3
Output Voltage vs. Termination Resistance
Output Voltage VOH(Z), VOL(Y) (V)
10 VOH(Z) 1 Y RT VCC = 5 V Ta = 25C
0.1
VOL(Y)
"L" VOL Z RT GND VOH
0.01
0.001 10 20
50 100 200 500 1k 2k 5k 10k 20k 50k Termination Resistance RT ()
Figure 8 Termination Resistance vs. Output Voltage Characteristics
Rev.2.00, Jul.16.2004, page 10 of 11
HD26C31
Package Dimensions
As of January, 2003
10.06 10.5 Max 16 9
5.5
Unit: mm
1
*0.20 0.05
8
0.80 Max
2.20 Max
0.20 7.80 + 0.30 -
1.15
1.27
0.10 0.10
0 - 8
0.70 0.20
*0.40 0.06
0.15
0.12 M
Package Code JEDEC JEITA Mass (reference value) FP-16DAV -- Conforms 0.24 g
*Ni/Pd/Au plating
Rev.2.00, Jul.16.2004, page 11 of 11
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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